Main Business
PCB,
MCPCB,
Microwave PCB,
PCB prototype,
Multi,
layer PCB,
Quick turn PCB,
About Us
manufacturer, contract manufacturer and PCB assembly companies worldwide.
PCB up to 32 layers, microwave material and MCPCB; prototypes, small to large volume are our business activities. We also actively research and build such high value added products
as HDI, quick turn, rigid-flex and backplane PCB's in the industry of telecommunications, consumer electronics, computers, medical apparatus and instruments, national defense and industrial equipment etc,
Accepted document format includes:
Gerber file RS-274-X format or RS-274-D with aperture list and drill file.
File designed with Protel
PAD2000
ORCAD
POWERPCB
Genisis2000
AutoCAD
Latest Selling Leads
XPC / FR-1 Single sided PCB
1) Single Sided PCB 2) Material: XPC (94HB), FR-1 (94V0) 3) Thickness: 1.0mm, 1.2mm, 1.6mm 4) Copper weight: 0.5 oz,
1) Single Sided PCB 2) Material: XPC (94HB), FR-1 (94V0) 3) Thickness: 1.0mm, 1.2mm, 1.6mm 4) Copper weight: 0.5 oz,
via in pad pcb
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5)
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5)
Thick PCB
1). 20*50mm/1up, 5mm thick 2). FR-4 material, 35 μm copper 3). Green solder mask /white silk screen. 4). Through hole,
1). 20*50mm/1up, 5mm thick 2). FR-4 material, 35 μm copper 3). Green solder mask /white silk screen. 4). Through hole,
Peelable mask PCB
1). Peters peelable mask on back side 2). 174 x 212mm, FR-4 Tg170 3). 4 layer,1.6mm, 1oz 4). Green solder mask/white
1). Peters peelable mask on back side 2). 174 x 212mm, FR-4 Tg170 3). 4 layer,1.6mm, 1oz 4). Green solder mask/white
Gold finger PCB
1). 98*32mm/1up, FR-4 Material 2). 8 layer, 1.0mm thick, 35 μm (1 oz) 3). LPI Green solder mask/White silk screen legen
1). 98*32mm/1up, FR-4 Material 2). 8 layer, 1.0mm thick, 35 μm (1 oz) 3). LPI Green solder mask/White silk screen legen
Fine pitch BGA PCB
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper we
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper we
Mini PCB
1). 6mm x 6mm, FR-4, 2). 1mm +/-0.1mm，Double sided 3). 2oz copper finished 3). Black solder mask/no silk ident 4). I
1). 6mm x 6mm, FR-4, 2). 1mm +/-0.1mm，Double sided 3). 2oz copper finished 3). Black solder mask/no silk ident 4). I
Rogers and FR-4 Combination PCB
1). FR-4 Tg 170 + Rogers RO4003C 2). 290*130mm/1up 3). 4 layers at 1.6mm thick 4). Green solder mask/White ident 5).
1). FR-4 Tg 170 + Rogers RO4003C 2). 290*130mm/1up 3). 4 layers at 1.6mm thick 4). Green solder mask/White ident 5).
Contact Information
| Company Name: | Bicheng Enterprise Company |
| Business Type: | Manufacturer |
| Address: | 3-203, Shidai Jingyuan, Fuyong, Baoan, Shenzhen |
| Postal Code: | 518103 |
| More Contact Information: |
|
| Company Website: |
http://www.bic-enterprise.com http://bcco.tradeprince.com |